To Leak or not to Leak?
Semiconductor and microelectronic packaging

Versaperm has announced expanded capabilities for semiconductor and microelectronics packaging applications through its advanced vapour permeability measurement technologies, addressing a growing industry need for accurate, predictive assessment of long-term semiconductor and microelectronics package integrity.

As device architectures become smaller and more sensitive, understanding true gas permeation through packaging materials, seals and thin films is increasingly critical to preventing moisture ingress, parametric drift and premature failure. Helium vapour permeability measurement has emerged as a preferred technique due to helium’s small atomic size, inert nature and ability to reveal diffusion-limited behaviour that cannot be detected through conventional leak testing alone.

At the centre of this capability is Versaperm’s mass spectrometry-based permeability system, designed to measure extremely low gas transmission rates with high sensitivity and repeatability. The system enables direct quantification of helium permeation through polymers, glasses, thin-film barriers and hybrid package structures, supporting both R&D and production qualification.

By resolving time dependent diffusion behaviour as well as steady state permeation, the technology allows engineers to distinguish between defect driven leakage and true material permeability, a distinction that is essential for lifetime modelling of hermetic, near-hermetic and MEMS packages.

Complementing this platform is Versaperm’s specialist helium sensor system, engineered specifically for applications where ultra-low permeation rates and long duration measurements are required. The sensor provides a stable, highly selective response to helium, enabling accurate accumulation-based measurements without the complexity of full mass spectrometry.

Together, these systems give semiconductor manufacturers, packaging houses and research organisations practical tools to evaluate barrier performance, qualify new materials and coatings and make informed design decisions based on quantified vapour permeability data rather than pass fail leak criteria. Through these technologies, Versaperm continues to support the microelectronics industry’s drive towards higher reliability, longer service life and greater confidence in package integrity.

Versaperm is a leading manufacturer of modular vapour permeability measurement systems used across energy, aerospace, packaging, pharmaceutical and electronics industries. With decades of specialist experience the company provides precise and high-performance solutions for development and production environments and also offers consultancy and laboratory testing services.

ENDS

Please send any sales enquiries to
Versaperm Ltd: 10 Rawcliffe House, Howarth Road, Maidenhead, Berkshire, SL6 1AP, UK,
e.mail: info@versaperm.com Web: www.versaperm.com
UK Tel: +44 (01628) 777668
USA Tel +1 (617) 855-7477

For Further Press Information please contact:
Gerry Palmer @ the Palmer & Rose Partnership
Tel +44 (0) 1494 637499
e.mail gerry@palmer-rose.co.uk